{"id":17647,"date":"2025-05-26T11:52:27","date_gmt":"2025-05-26T11:52:27","guid":{"rendered":"https:\/\/tedae.org\/?p=17647"},"modified":"2025-05-26T11:57:39","modified_gmt":"2025-05-26T11:57:39","slug":"tedae-firma-un-acuerdo-con-la-asociacion-finlandesa-de-industrias-de-defensa-y-aeroespacial","status":"publish","type":"post","link":"https:\/\/tedae.org\/en\/uncategorized\/tedae-firma-un-acuerdo-con-la-asociacion-finlandesa-de-industrias-de-defensa-y-aeroespacial\/","title":{"rendered":"TEDAE firma un acuerdo con la asociaci\u00f3n Finlandesa de Industrias de Defensa y Aeroespacial (PIA)"},"content":{"rendered":"<p>El acuerdo con PIA durante FEINDEF est\u00e1 centrado en fortalecer la competitividad de la industria, as\u00ed como la posici\u00f3n de la industria dentro de la Base Tecnol\u00f3gica e Industrial de Defensa Europea (EDTIB, por sus siglas en ingl\u00e9s).<\/p>\n\n\n\n<p>Esta firma permitir\u00e1 compartir informaci\u00f3n sobre temas de inter\u00e9s relacionados con la industria de defensa y seguridad, incluidas las pol\u00edticas europeas, as\u00ed como informaci\u00f3n entre sus empresas asociadas y explorar posibilidades de colaboraci\u00f3n.<\/p>\n\n\n\n<figure class=\"wp-block-image size-large\"><img fetchpriority=\"high\" decoding=\"async\" width=\"1024\" height=\"683\" src=\"https:\/\/tedae.org\/wp-content\/uploads\/2025\/05\/PIA-2-1024x683.jpg\" alt=\"\" class=\"wp-image-17648\" srcset=\"https:\/\/tedae.org\/wp-content\/uploads\/2025\/05\/PIA-2-1024x683.jpg 1024w, https:\/\/tedae.org\/wp-content\/uploads\/2025\/05\/PIA-2-300x200.jpg 300w, https:\/\/tedae.org\/wp-content\/uploads\/2025\/05\/PIA-2-768x512.jpg 768w, https:\/\/tedae.org\/wp-content\/uploads\/2025\/05\/PIA-2-18x12.jpg 18w, https:\/\/tedae.org\/wp-content\/uploads\/2025\/05\/PIA-2-150x100.jpg 150w, https:\/\/tedae.org\/wp-content\/uploads\/2025\/05\/PIA-2-450x300.jpg 450w, https:\/\/tedae.org\/wp-content\/uploads\/2025\/05\/PIA-2-1200x800.jpg 1200w, https:\/\/tedae.org\/wp-content\/uploads\/2025\/05\/PIA-2.jpg 1500w\" sizes=\"(max-width: 1024px) 100vw, 1024px\" \/><\/figure>\n\n\n\n<p><\/p>","protected":false},"excerpt":{"rendered":"<p>El acuerdo con PIA durante FEINDEF est\u00e1 centrado en fortalecer la competitividad de la industria, as\u00ed como la posici\u00f3n de la industria dentro de la Base Tecnol\u00f3gica e Industrial de Defensa Europea (EDTIB, por sus siglas en ingl\u00e9s). Esta firma permitir\u00e1 compartir informaci\u00f3n sobre temas de inter\u00e9s relacionados con la industria de defensa y seguridad,<\/p>","protected":false},"author":5,"featured_media":17649,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_jetpack_memberships_contains_paid_content":false,"footnotes":""},"categories":[1],"tags":[431],"class_list":{"0":"post-17647","1":"post","2":"type-post","3":"status-publish","4":"format-standard","5":"has-post-thumbnail","7":"category-uncategorized","8":"tag-newsletters"},"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.5 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>TEDAE firma un acuerdo con la asociaci\u00f3n Finlandesa de Industrias de Defensa y Aeroespacial (PIA) - TEDAE<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/tedae.org\/en\/uncategorized\/tedae-firma-un-acuerdo-con-la-asociacion-finlandesa-de-industrias-de-defensa-y-aeroespacial\/\" \/>\n<meta property=\"og:locale\" content=\"en_GB\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"TEDAE firma un acuerdo con la asociaci\u00f3n Finlandesa de Industrias de Defensa y Aeroespacial (PIA) - TEDAE\" \/>\n<meta property=\"og:description\" content=\"El acuerdo con PIA durante FEINDEF est\u00e1 centrado en fortalecer la competitividad de la industria, as\u00ed como la posici\u00f3n de la industria dentro de la Base Tecnol\u00f3gica e Industrial de Defensa Europea (EDTIB, por sus siglas en ingl\u00e9s). 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